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  1 / 4 www.asb.co.kr june 2009 p lerow tm aln1220at internally matched lna module the plerow tm aln - series is the compactly designed surface - mount module for the use o f the lna with or without the following gain blocks in the infrastructure equipment of the mobile wireless (cdma, gsm, pcs, phs, wcdma, dmb, wlan, wibro, wimax), gps, satellite commun i- cation terminals , catv and so on. it has an exceptional performance of l ow noise figure, high gain, high oip3, and low bias current. the stability factor is always kept more than unity over the application band in order to ensure its unconditionally stable implementation to the application system environment. the surface - mount module package including the completed matching circuit and other components necessary just in case allows very simple and convenient implementation onto the system board in mass production level. parameter unit specifications min typ max frequency range mhz 940 1500 gain db 16.5 17.5 gain flatness db ? 1.5 ? 1.6 noise figure db 0.65 0.70 output ip3 (1) dbm 27 28 s11 / s22 (2) db - 13 / - 8 output p1db dbm 14 15 switching time (3) ? sec supply current ma 40 60 supply voltage v 5 impedance ? 50 max. rf input power dbm c.w 29 ~ 31 (before fail) package type & size mm surface mount type, 10wx10lx3.8h operating temperature is - 40 ? c to +85 ? c. 1) oip3 is measured with two tones at an output power of +0 dbm / tone separated by 1 mhz. 2) s11/s22 (max) is the worst value within the frequency band. 3) switching time means the time that takes for output power to get stabilized to its final level after switching dc voltage fr om 0 v to v s . pin number function 2 rf in 5 rf out 6 v s other s ground feature s s 21 = 19.0 db @ 940 m hz = 16.0 db @ 1500 mhz nf of 0.65 db over fr e quency unconditionally stable single 5v supply high oip3 @ low current c o u pl er note: 1. the number and size of ground via holes in a circuit bo ard is critical for thermal rf grounding consider a tions. 2. we recommend that the ground via holes be placed on the bottom of all ground pins for better rf and thermal performance, as shown in the dra w ing at the left side. website: www.asb.co.kr e - mail: sales@asb.co.kr tel: (82) 42 - 528 - 722 3 f ax : (82) 42 - 528 - 7222 more inform a tion c o u pl er c o u pl er c o u pl er c o u pl er (recommended footprint) aln1220at asb inc. (top view) (bottom view) ? 0.4 plated thru holes to ground plane plerow (side view) 1 - stage single type description specifications (in pr o duction) typ. @ t = 25 ? c, v s = 5 v, freq. =1220 mhz, z o.sys = 50 o hm ou t line drawing (unit: mm) solder stencil area
2 / 4 www.asb.co.kr june 2009 p lerow tm aln1220at internally matched lna module s - param e ters noise figure oip3 p1db 940~1500 mhz +5 v typical performance (measured) s - parameters & k fa c tor
3 / 4 www.asb.co.kr june 2009 p lerow tm aln1220at internally matched lna module 1. s - parameter 2. oip3, p1db & nf note: tested at room temperature. 1. s - parameter 2. oip3, p1db & nf note: tested at v s = 5 v . 940 mhz 1220 mhz 1500 mhz s21 (db) s11 (db) s22 (db) s21 (db) g/f (db) s11 (db) s22 (db) s21 (db) s11 (db) s22 (db) 4.50 v 18.86 - 13.77 - 9.652 17.42 2.76 - 14.66 - 11.46 16.10 - 14.62 - 12.03 4.75 v 18.91 - 14.16 - 9.841 17.47 2.75 - 15.04 - 11.58 16.16 - 14.95 - 12.02 5.00 v 18.94 - 14.47 - 9.995 17.51 2.75 - 15.40 - 11.67 16.19 - 15.26 - 12.01 5.25 v 18.97 - 14.79 - 10.12 17.53 2.75 - 15.73 - 11.76 16.22 - 15.50 - 11.95 5.50 v 18.99 - 15.06 - 10.26 17.55 2.75 - 16.00 - 11.86 16.24 - 15.75 - 11.88 940 mhz 1220 mhz 1500 mhz oip3 (dbm) p1db (dbm) nf (db) oip3 (dbm) p1db (dbm) nf (db) oip3 (dbm) p1db (dbm) nf (db) 4.50 v 27.62 14.70 0.380 30.47 15.83 0.577 31.26 16.51 0.527 4.75 v 28.75 15.45 0.390 31.50 16.25 0.570 32.07 17.11 0.537 5.00 v 29.10 16.06 0.398 32.06 16.95 0.547 32.74 17.60 0.527 5.25 v 29.44 16.52 0.417 32.47 17.20 0 .570 33.15 18.05 0.531 5.50 v 29.87 17.00 0.422 32.96 17.85 0.565 33.51 18.45 0.545 940 mhz 1220 mhz 1500 mhz s21 (db) s11 (db) s22 (db) s21 (db) g/f (db) s11 (db) s22 (db) s21 (db) s11 (db) s22 (db) - 45 ? c 19. 16 - 13.02 - 10.62 17.75 2.70 - 15.85 - 11.37 16.46 - 17.38 - 11.29 - 10 ? c 19.04 - 13.95 - 10.20 17.65 2.71 - 15.62 - 11.40 16.33 - 16.29 - 11.97 25 ? c 18.94 - 14.33 - 9.947 17.53 2.70 - 14.92 - 11.30 16.24 - 15.05 - 12.10 60 ? c 18.82 - 14.56 - 9.752 17.40 2.71 - 14.57 - 11. 12 16.11 - 14.66 - 11.95 85 ? c 18.67 - 14.72 - 9.664 17.24 2.71 - 14.25 - 11.05 15.96 - 14.24 - 11.83 940 mhz 1220 mhz 1500 mhz oip3 (dbm) p1db (dbm) nf (db) oip3 (dbm) p1db (dbm) nf (db) oip3 (dbm) p1db (dbm) nf (db) - 45 ? c 29.48 16.17 0.297 31.70 16.93 0.384 32.85 17.46 0.378 - 10 ? c 29.45 16.20 0.404 31.55 16.94 0.556 32.78 17.40 0.542 25 ? c 29.35 16.26 0.450 31.45 16.96 0.579 32.75 17.38 0.603 60 ? c 28.84 16.05 0.650 31.20 16.72 0.684 32.70 17.12 0.725 85 ? c 28.35 15.87 0.772 30.76 16.5 1 0.784 32.15 16.67 0.805 rf performance with operating temperature rf performance with voltage change
4 / 4 www.asb.co.kr june 2009 p lerow tm aln1220at internally matched lna module 1) the tantal or mlc (multi layer ceramic) capacitor is optional and for bypassing the ac noise introduced from the dc supply. the capacitance value may be determined by cu stomer s dc supply status . the c a- pacitor should be placed as close as possible to v s pin and be connected directly to the ground plane for the best electrical performance . 2) dc blocking capacitors are always necessarily placed at the input and output port f or allowing only the rf signal to pass and blocking the dc component in the signal. the dc blocking capacitors are inclu d- ed inside the aln module. therefore, c1 & c2 capacitors may not be necessary, but can be added just in case that the customer wants. th e value of c1 & c2 is determined by considering the application fr e- quency. application circuit recommended soldering reflow process 20~40 sec 260 ? c 200 ? c 150 ? c 60~180 sec ramp - up (3 ? c/sec) ramp - down (6 ? c/sec) in out vs size 25x25mm (for aln - at, bt, t series C 10x10mm) + - aln out in c1 c2 v s tantal or mlc (multi layer c e ramic) c a pacitor evaluation board layout


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